Method and apparatus for positioning heating elements

ABSTRACT

An underlayment system is provided that includes a plurality of protrusions that extend from a common base member. The protrusions and base member can include an opening therethrough that allows for subsequent layers of material, such as adhesive, to interact and bond to each other. The protrusions are arranged in such a way to contain a wire, string, or heating element, within a receiving area. The arrangement of the protrusions allow for routing of the wire, string, or heating element in a variety of angles, bends, and other routing layouts.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. patent applicationSer. No. 15/260,848, filed Sept. 9, 2016, which is a divisional of U.S.patent application Ser. No. 14/829,108, filed Aug. 18, 2015, now U.S.Pat. No. 9,625,163, which claims the benefit of U.S. Provisional PatentApplication Ser. No. 62/038,733, filed Aug. 18, 2014, all of which arefully incorporated by reference herein.

FIELD OF THE INVENTION

Embodiments of the present invention are generally related tounderlayments associated with radiant floor or wall heating systems.

BACKGROUND

In-floor and in-wall heating and cooling is well known that utilizesheat conduction and radiant heat, for example, for indoor climatecontrol rather than forced air heating that relies on convection. Theheat is usually generated by a series of pipes that circulate heatedwater or by electric cable, mesh, or film that provide heat when acurrent is applied thereto. In-floor radiant heating technology is usedcommonly in homes and businesses today.

Electrical floor heating systems have very low installation costs andare well suited for kitchens, bathrooms, or in rooms that requireadditional heat, such as basements. One advantage of electric floorheating is the height of installation. For example, floor buildup can beas little as about one millimeter as the electric cables are usuallyassociated with a specialized installation board or directly onto thesub floor. Electric underfloor heating is also installed very quickly,usually taking a half a day to a day depending on the size of the areato be heated. In addition, warm up times are generally decreased becausethe cables are installed approximate to the finished flooring, e.g.,tile, wherein direct connection is made with the heat source rather thana stored water heater as in fluid-based systems. Electric systems areoffered in several different forms, such as those that utilize a longcontinuous length cable or those that employ a mat with embedded heatingelements. In order to maximize heat transfer, a bronze screen or carbonfilm heating element may be also used. Carbon film systems are normallyinstalled under the wire and onto a thin insulation underlay to reducethermal loss to the sub floor. Vinyls, carpets, and other soft floorfinishes can be heated using carbon film elements or bronze screenelements.

Another type of in-floor heating system is based on the circulation ofhot water, i.e., a “hydronic” system. In a hydronic system, warm wateris circulated through pipes or tubes that are incorporated into thefloor and generally uses pipes from about 11/16 inch to 1 inch tocirculate hot water from which the heat emanates. The size of tubesgenerally translates into a thicker floor, which may be undesirable. Oneother disadvantage of a hydronic system is that a hot water storage tankmust be maintained at all times, which is less efficient than anelectric floor heating system.

In order to facilitate even heating of a floor, the wires mustpreferably be spaced at specific locations. One such system is disclosedin U.S. Patent Application Publication No. 2009/0026192 to Fuhrman(“Fuhrman”), which is incorporated by reference in its entirety herein.Fuhrman discloses a mat with a plurality of studs extending therefromthat help dictate the location of the wires. The mat with associatedstuds is placed over a sub floor with a layer of adhesive therebetween.Another layer of adhesive is placed above of the studs. The studs alsoguide the finishers to form a correct floor thickness. The studs thusprovide a location for interweaving the wire or wires that are used inthe heating system. The wire of Fuhrman, however, is not secured betweenadjacent studs and still may separate therefrom, which may cause unevenheating or wire damage. Furthermore, Fuhrman discloses a continuous matwherein subsequent layers of adhesive are not able to interact withthose previously placed.

SUMMARY

It is with respect to the above issues and other problems that theembodiments presented herein were contemplated. In general, embodimentsof the present disclosure provide methods, devices, and systems by whichvarious elements, such as wire, heating elements, and the like, may berouted and/or contained in a flooring underlayment. In one embodiment,the underlayment may include a number of protrusions extending from abase material. The protrusions may be configured in a cluster, or array,or even as part of another protrusion, forming routing hubs. As providedherein, a wire may be routed around, through, and even around andthrough the routing hubs and/or protrusions. The unique shape andarrangement of the protrusions disclosed herein can provide for theefficient routing of wires in an underlayment for any shape and/orpurpose.

In some embodiments, the protrusion forms a geometric shape extendingaway from a base material surface to a contact surface (e.g., thecontact surface for flooring, tile, etc.). This extension between thebase material surface and the contact surface defines the overallprotrusion height. The protrusion may include a number of sidesextending from the base material to the contact surface. As can beappreciated, at least one of the sides of the protrusion may include asurface configured to receive a wire. This receiving surface can beconcave, convex, arcuate, linear, etc., and/or combinations thereof.Additionally or alternatively, the surface may follow, or contour, thegeometric shape of the protrusion.

It is an aspect of the present disclosure that at least two protrusionsare arranged adjacent to one another on an underlayment base material.In one embodiment, the protrusions may be arranged such that thereceiving surface of a first protrusion is offset from and facing thereceiving surface of a second protrusion. The distance of the offset andthe receiving surfaces can form a receiving cavity configured to receivea wire, heating element, or other element. For example, an underlaymentmay include a number of protrusions arranged about an array axis to forma routing hub. Where four protrusions make up a routing hub, there mayexist heating element receiving cavities disposed between eachprotrusion. Additionally or alternatively, the underlayment may includea number of routing hubs equally-spaced along a first linear directionand/or a second linear direction to form a matrix of routing hubs. Inthis case, additional heating element receiving cavities may be disposedbetween each routing hub. As can be appreciated, the matrix of routinghubs and the array of protrusions allow for heating elements to berouted in the underlayment according to any configuration of routingcurves, angles, and/or lines.

In some embodiments, the protrusions, base material, and/or otherfeatures of the underlayment may be formed into a shape from at leastone material. Examples of forming can include, but are not limited to,thermoforming, thermo-molding, injection molding, casting, molding,rotational molding, reaction injection, blow molding, vacuum forming,twin sheet forming, compression molding, machining, 3D printing, etc.,and/or combinations thereof.

The protrusions, base material, and/or other features of theunderlayment may include a number of cutouts, or holes. In someembodiments, the cutouts can extend at least partially into theprotrusion, base material, and/or the underlayment. In one embodiment,one or more of the cutouts may completely pass through the underlayment.In any event, the cutouts may be configured to receive a matingmaterial. For instance, the cutouts may be configured to receiveadhesive, epoxy, grout, cement, glue, plastic, or other material capableof flowing at least partially into the cutouts. These cutouts canprovide a number of surfaces on the underlayment to which material canadhere, or key. Additionally or alternatively, these cutouts canincrease the strength of the underlayment by providing a structuralskeleton, around which material can flow and cure in addition toproviding a pathway for airflow, thereby enabling the utilization of amodified thinset, which requires air for curing. The cutouts furtherprovide a passageway for moisture to flow out of the subfloor. In oneembodiment, the cutouts may be provided via the forming process of theunderlayment. In another embodiment, the cutouts may be made via acutting operation performed prior to the forming process. In yet anotherembodiment, the cutouts may be made via a cutting operation performedsubsequent to the forming process.

The underlayment may include areas in and/or between the routing hubsthat are configured to receive material. For instance, the areas may beconfigured to receive adhesive, epoxy, grout, cement, glue, plastic, orother material capable of flowing at least partially into the areas.These areas can provide a number of surfaces on the underlayment towhich material can adhere, or key. Additionally or alternatively, theseareas can increase the strength of the underlayment by providing astructural skeleton, around which material can flow and cure.

In some embodiments, the underlayment may include a pad layer. The padlayer may include a sound dampening material, heat reflective material,insulative material, porous substrate, vapor barrier, waterproofmaterial, energy reflective material, etc., and/or combinations thereof.Examples of pad layers can include, but are in no way limited to, foil,cork, rubber, plastic, concrete, wood, organic materials, inorganicmaterials, composites, compounds, etc., and/or combinations thereof. Thepad layer may be attached to the base material via adhesive, thermalbonding, welding, mechanical attachment, etc., and/or combinationsthereof. As can be appreciated, the pad layer may include adhesive onthe side opposite the base material side for affixing to a surface, suchas a subfloor, floor, etc. In one embodiment, the pad layer may beconfigured to receive adhesive for affixing to a surface.

The phrases “at least one”, “one or more”, and “and/or” are open-endedexpressions that are both conjunctive and disjunctive in operation. Forexample, each of the expressions “at least one of A, B and C”, “at leastone of A, B, or C”, “one or more of A, B, and C”, “one or more of A, B,or C” and “A, B, and/or C” means A alone, B alone, C alone, A and Btogether, A and C together, B and C together, or A, B and C together.When each one of A, B, and C in the above expressions refers to anelement, such as X, Y, and Z, or class of elements, such as X₁-X_(n),Y₁-Y_(m), and Z₁-Z_(o), the phrase is intended to refer to a singleelement selected from X, Y, and Z, a combination of elements selectedfrom the same class (e.g., X₁ and X₂) as well as a combination ofelements selected from two or more classes (e.g., Y₁ and Z_(o)).

The term “a” or “an” entity refers to one or more of that entity. Assuch, the terms “a” (or “an”), “one or more” and “at least one” can beused interchangeably herein. It is also to be noted that the terms“comprising”, “including”, and “having” can be used interchangeably.

The term “means” as used herein shall be given its broadest possibleinterpretation in accordance with 35 U.S.C., Section 112, Paragraph 6.Accordingly, a claim incorporating the term “means” shall cover allstructures, materials, or acts set forth herein, and all of theequivalents thereof. Further, the structures, materials or acts and theequivalents thereof shall include all those described in the summary ofthe invention, brief description of the drawings, detailed description,abstract, and claims themselves.

It should be understood that every maximum numerical limitation giventhroughout this disclosure is deemed to include each and every lowernumerical limitation as an alternative, as if such lower numericallimitations were expressly written herein. Every minimum numericallimitation given throughout this disclosure is deemed to include eachand every higher numerical limitation as an alternative, as if suchhigher numerical limitations were expressly written herein. Everynumerical range given throughout this disclosure is deemed to includeeach and every narrower numerical range that falls within such broadernumerical range, as if such narrower numerical ranges were all expresslywritten herein.

The preceding is a simplified summary of the disclosure to provide anunderstanding of some aspects of the disclosure. This summary is neitheran extensive nor exhaustive overview of the disclosure and its variousaspects, embodiments, and configurations. It is intended neither toidentify key or critical elements of the disclosure nor to delineate thescope of the disclosure but to present selected concepts of thedisclosure in a simplified form as an introduction to the more detaileddescription presented below. As will be appreciated, other aspects,embodiments, and configurations of the disclosure are possibleutilizing, alone or in combination, one or more of the features setforth above or described in detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are incorporated into and form a part of thespecification to illustrate several examples of the present disclosure.These drawings, together with the description, explain the principles ofthe disclosure. The drawings simply illustrate preferred and alternativeexamples of how the disclosure can be made and used and are not to beconstrued as limiting the disclosure to only the illustrated anddescribed examples. Further features and advantages will become apparentfrom the following, more detailed, description of the various aspects,embodiments, and configurations of the disclosure, as illustrated by thedrawings referenced below.

FIG. 1 shows a plan view of an underlayment section in accordance withembodiments of the present disclosure;

FIG. 2 shows a cross-sectional view of an area of the underlayment takenalong line A-A shown in FIG. 1;

FIG. 3 shows a detail cross-sectional view of an area of theunderlayment in accordance with embodiments of the present disclosure;

FIG. 4 shows a detail plan view of a routing hub of the underlayment inaccordance with embodiments of the present disclosure;

FIG. 5 shows a plan view of routing hubs of an underlayment inaccordance with a first embodiment of the present disclosure;

FIG. 6 shows a plan view of routing hubs of an underlayment inaccordance with a second embodiment of the present disclosure;

FIG. 7 shows a detail cross-sectional view of a first embodiment of therouting hubs taken along line D-D shown in FIG. 6; and

FIG. 8 shows a detail cross-sectional view of a second embodiment of therouting hubs taken along line D-D shown in FIG. 6.

DETAILED DESCRIPTION

Before any embodiments of the disclosure are explained in detail, it isto be understood that the disclosure is not limited in its applicationto the details of construction and the arrangement of components setforth in the following description or illustrated in the followingdrawings. The disclosure is capable of other embodiments and of beingpracticed or of being carried out in various ways. Also, it is to beunderstood that the phraseology and terminology used herein is for thepurpose of description and should not be regarded as limiting. The useof “including,” “comprising,” or “having” and variations thereof hereinis meant to encompass the items listed thereafter and equivalentsthereof as well as additional items.

FIG. 1 shows a plan view of an underlayment section 1 in accordance withembodiments of the present disclosure. The underlayment section 1includes a number of routing hubs 2, comprising four protrusions 2 aarranged in an equally-spaced circular array about an array axis 2 b, ina matrix configuration. The matrix is configured in the form of an eightrow by twelve column matrix of routing hubs 2. The matrix providesheating element receiving cavities 3 in the X-direction, Y-direction,and in directions approximately 45 degrees to the X-direction and/or theY-direction. A sample routing 4 of the heating element 5 is shown inFIG. 1. In particular, the heating element section 5 shown runs alongthe Y-direction between the first and second columns of routing hubs 2,proceeds around the routing hub 2 in the first row and second column(2,8) and along the negative Y-direction between the second and thirdcolumns to the (3,1) routing hub 2, proceeds along the Y-directionbetween the third and fourth columns until about the (3,4) routing hub2, and then proceeds diagonally through the heating element receivingcavities 3 in the (4, 5), (5, 6), (6, 7), and (7, 8) routing hubs 2, andso on.

FIG. 2 shows a cross-sectional view of an area of the underlayment 1taken along line A-A. In some embodiments, one or more of theprotrusions 2 a can extend from the base material surface 6 to a contactsurface 7. The contact surface 7 may be configured to support tile,flooring, or other material. The distance from the base material 6 tothe contact surface 7 is called the protrusion height 7 a. The thicknessof the base material 6 is called the base thickness 6 a. In someembodiments, the protrusions 2 a may be formed from the base material 6,and as such, may have a wall thickness approximately equal to that ofthe base thickness 6 a.

FIG. 3 shows a detail cross-sectional view of an area of theunderlayment 1 in accordance with embodiments of the present disclosure.In one embodiment, the areas adjacent to each protrusion 2 a can form aheating element receiving cavity 3. Each heating element receivingcavity 3 can include an interference fit 8, or contained area, to hold aheating element 5 or wire in place. In some cases, the heating element 5may be inserted into the heating element receiving cavity 3 with apredetermined amount of force required to part (e.g., elasticallydeform, plastically deform, flex, and/or deflect, etc.) at least one ofthe receiving surfaces 9 of the cavity. In one embodiment, when theheating element 5 is inserted into the heating element receiving cavity3 the at least one of the receiving surfaces 9 may return to an originalposition thereby closing the heating element receiving cavity 3 andcontaining the heating element 5.

FIG. 4 shows a detail plan view of a routing hub 2 of the underlayment 1in accordance with embodiments of the present disclosure. The heatingelement receiving cavities 3 are shown disposed between protrusions 2 aand/or routing hubs 2. In some embodiments, one or more of the heatingelement receiving cavities 3 can be configured differently from anotherheating element receiving cavity 3. For instance, several heatingelement receiving cavities 3 may be configured to provide a frictionalfit for holding a heating element 5, while other heating elementreceiving cavities 3 may be configured to merely contain a heatingelement 5. In any event, the underlayment 1 can include one or moreconfigurations of heating element receiving cavity 3.

FIG. 5 shows a plan view of routing hubs 2 of an underlayment 1 inaccordance with a first embodiment of the present disclosure. Asdescribed above, the protrusions 2 a, base material 6, and/or otherfeatures of the underlayment 1 may include a number of cutouts 10, orholes. In some embodiments, the cutouts 10 can extend at least partiallyinto the protrusion 2 a, base material 6, and/or the underlayment 1. Insome embodiments, the cutouts 10 are shown as extending at leastpartially into at least one side of at least one protrusion 2 a.

FIG. 6 shows a plan view of routing hubs 2 of an underlayment 1 inaccordance with a second embodiment of the present disclosure. Theunderlayment 1 section includes a number of routing hubs 2, comprisingfour protrusions 2 a arranged in an equally-spaced circular array aboutan array axis 2 b, in a matrix configuration. A sample routing 4 of theheating element 5 is shown in FIG. 6. In particular, the heating elementsection 5 shown runs along the Y-direction of the first column ofrouting hubs 2, proceeds around the routing hub 2 in the second row andfirst column (1,2) and along the negative Y-direction between the firstand second columns, and then proceeds diagonally through the heatingelement receiving cavity 3 in the (2, 1) routing hub 2.

FIG. 7 shows a detail cross-sectional view of a first embodiment of therouting hubs 2 taken along line D-D shown in FIG. 6. As shown, theheating element receiving cavity 3 in FIG. 7 includes arcuate receivingsurfaces 9. The arcuate receiving surfaces 9 may be configured asconcave, curvilinear, arched, and/or other shape configured to receivethe heating element 5. In some cases, at least one of the arcuatereceiving surfaces 9 of the routing hubs may be configured to contactthe heating element receiving cavity 3. The contact may provide africtional force that retains the heating element 5 in the underlayment1. In some embodiments, the arcuate receiving surfaces 9 may contain theheating elements 5 in the heating element receiving cavity 5 withoutfrictional contact.

Additionally or alternatively, the underlayment 1 may include a padlayer 11. The pad layer 11 may include a sound dampening material, heatreflective material, insulative material, porous substrate, vaporbarrier, waterproof material, energy reflective material, etc., and/orcombinations thereof. Examples of pad layers 11 can include, but are inno way limited to, foil, cork, rubber, plastic, concrete, wood, organicmaterials, inorganic materials, composites, compounds, etc., and/orcombinations thereof. The pad layer 11 may be attached to the basematerial 6 via adhesive, thermal bonding, welding, mechanicalattachment, etc., and/or combinations thereof. As can be appreciated,the pad layer 11 may include adhesive on the side opposite the basematerial 6 side for affixing to a surface, such as a subfloor, floor,etc. In one embodiment, the pad layer 11 may be configured to receiveadhesive for affixing to a surface. It should be appreciated that any ofthe underlayment 1 embodiments as disclosed may include such a pad layer11. In some embodiments, there may be additional pad layers 11, oneabove another (e.g., a stack of two, three, four, five, or more padlayers 11) for strengthening and controlling anti-fracture. This enablesisolation of cracks in a substrate from traveling to the tile layer.

FIG. 8 shows a detail cross-sectional view of a second embodiment of therouting hubs 2 taken along line D-D shown in FIG. 6. As shown, theheating element receiving cavity 3 in FIG. 8 includes angular receivingsurfaces 9. The angular receiving surfaces 9 may be configured as adraft angle 9 a, a dovetail, a “V” shape, or other channel shapeconfigured to receive the heating element 5. In some cases, at least oneof the angular receiving surfaces 9 of the routing hubs 2 may beconfigured to contact the heating element receiving cavity 3. Thecontact may provide a frictional force that retains the heating element5 in the underlayment 1. In some embodiments, the angular receivingsurfaces 9 may contain the heating elements 5 in the heating elementreceiving cavity 5 without frictional contact.

To avoid unnecessarily obscuring the present disclosure, the precedingdescription omits a number of known structures and devices. Thisomission is not to be construed as a limitation of the scopes of theclaims. Specific details are set forth to provide an understanding ofthe present disclosure. It should, however, be appreciated that thepresent disclosure may be practiced in a variety of ways beyond thespecific detail set forth herein.

While the flowcharts have been discussed and illustrated in relation toa particular sequence of events, it should be appreciated that changes,additions, and omissions to this sequence can occur without materiallyaffecting the operation of the disclosed embodiments, configuration, andaspects.

A number of variations and modifications of the disclosure can be used.It would be possible to provide for some features of the disclosurewithout providing others.

The present disclosure, in various aspects, embodiments, and/orconfigurations, includes components, methods, processes, systems and/orapparatus substantially as depicted and described herein, includingvarious aspects, embodiments, configurations embodiments,subcombinations, and/or subsets thereof. Those of skill in the art willunderstand how to make and use the disclosed aspects, embodiments,and/or configurations after understanding the present disclosure. Thepresent disclosure, in various aspects, embodiments, and/orconfigurations, includes providing devices and processes in the absenceof items not depicted and/or described herein or in various aspects,embodiments, and/or configurations hereof, including in the absence ofsuch items as may have been used in previous devices or processes, e.g.,for improving performance, achieving ease and/or reducing cost ofimplementation.

The foregoing discussion has been presented for purposes of illustrationand description. The foregoing is not intended to limit the disclosureto the form or forms disclosed herein. In the foregoing DetailedDescription for example, various features of the disclosure are groupedtogether in one or more aspects, embodiments, and/or configurations forthe purpose of streamlining the disclosure. The features of the aspects,embodiments, and/or configurations of the disclosure may be combined inalternate aspects, embodiments, and/or configurations other than thosediscussed above. This method of disclosure is not to be interpreted asreflecting an intention that the claims require more features than areexpressly recited in each claim. Rather, as the following claimsreflect, inventive aspects lie in less than all features of a singleforegoing disclosed aspect, embodiment, and/or configuration. Thus, thefollowing claims are hereby incorporated into this Detailed Description,with each claim standing on its own as a separate preferred embodimentof the disclosure.

Moreover, though the description has included description of one or moreaspects, embodiments, and/or configurations and certain variations andmodifications, other variations, combinations, and modifications arewithin the scope of the disclosure, e.g., as may be within the skill andknowledge of those in the art, after understanding the presentdisclosure. It is intended to obtain rights which include alternativeaspects, embodiments, and/or configurations to the extent permitted,including alternate, interchangeable and/or equivalent structures,functions, ranges or steps to those claimed, whether or not suchalternate, interchangeable and/or equivalent structures, functions,ranges or steps are disclosed herein, and without intending to publiclydedicate any patentable subject matter.

What is claimed is:
 1. A support structure for electric heating cables,comprising: a base having a first side and a second side opposite thefirst side; a matrix of routing hubs extending from the first side ofthe base, each routing hub comprising a plurality of protrusion arrangedin an equally-spaced circular array about array axis, each of theplurality of protrusions comprising an outer wall, an upper surface, andan inner wall sloping continuously away from the outer wall and towardthe base, the outer walls of the protrusions defining a plurality ofreceiving cavities configured to receive a heating element; and a padlayer attached to the second side of the base.
 2. The support structureof claim 1, wherein the pad layer comprises a heat reflective material,an energy reflective material, or a combination thereof.
 3. The supportstructure of claim 1, wherein the pad layer comprises a sound dampeningmaterial, an insulative material, or a combination thereof.
 4. Thesupport structure of claim 1, wherein the pad layer comprises a poroussubstrate, a vapor barrier, a waterproof material, or a combinationthereof.
 5. The support structure of claim 1, wherein the pad layercomprises foil, cork, rubber, plastic, concrete, wood, organic material,inorganic material, composite material, a compound, or a combinationthereof.
 6. The support structure of claim 1, wherein the pad layer isattached to the second side of the base via adhesive, thermal bonding,welding, mechanical attachment, or a combination thereof.
 7. The supportstructure of claim 1, wherein the pad layer comprises adhesive on a sidethereof opposite the second side of the base material, the adhesivecapable of affixing the support structure to a surface.
 8. The supportstructure of claim 1, wherein the pad layer is configured to receiveadhesive for affixing the support structure to a surface.
 9. The supportstructure of claim 1, wherein the support structure comprises aplurality of pad layers in a stacked configuration.
 10. A floorunderlayment comprising: a base having a first side and a second side; aplurality of routing hubs arranged in rows and columns on the base, eachrouting hub comprising a plurality of protrusions extending from thefirst side of the base, each one of the plurality of protrusionscomprising a curved outer wall, a curved inner wall, and a top surfacesubstantially parallel to the base, the curved outer walls of theplurality of protrusions of each routing hub forming a non-continuouscircle, and the curved inner walls of the plurality of protrusions ofeach routing hub forming a non-continuous circle; and a plurality ofholes in the base, wherein the plurality of routing hubs define aplurality of receiving cavities adapted to receive a heating elementtherein.
 11. The floor underlayment of claim 10, wherein at least one ofthe plurality of holes is located outside of the outer walls of theplurality of protrusions of any one of the plurality of routing hubs.12. The floor underlayment of claim 10, further comprising a heatingelement positioned in at least one of the receiving cavities.
 13. Thefloor underlayment of claim 10, further comprising a pad layer attachedto the second side of the base.
 14. The floor underlayment of claim 13,wherein the pad layer comprises a heat reflective material, an energyreflective material, or a combination thereof.
 15. The floorunderlayment of claim 13, wherein the pad layer comprises an insulativematerial, a porous substrate, or a combination thereof.
 16. The floorunderlayment of claim 13, wherein the pad layer comprises foil, cork,rubber, plastic, concrete, wood, organic material, inorganic material,composite material, a compound, or a combination thereof.
 17. The floorunderlayment of claim 13, wherein the pad layer is attached to thesecond side of the base via adhesive, thermal bonding, welding,mechanical attachment, or a combination thereof.
 18. The floorunderlayment of claim 13, wherein the pad layer comprises adhesive on aside thereof opposite the second side of the base material, the adhesiveuseful for affixing the support structure to a surface.
 19. A floorheating system, comprising: a base member comprising a plurality ofholes; and a plurality of routing hubs extending from a first side ofthe base member, each one of the plurality of routing hubs comprising aplurality of protrusions arranged in an equally-spaced circular arrayabout an array axis, each of the plurality of protrusions comprising acurved outer wall, a curved inner wall, and a top surface parallel tothe base member, wherein the curved inner wall slopes continuously awayfrom the curved outer wall and toward the base member, and wherein theplurality of routing hubs are arranged into rows and columns, andadjacent ones of the plurality of routing hubs define channels forsecuring a heating element.
 20. The floor heating system of claim 19,wherein at least one of the plurality of holes is located outside of anyone of the plurality of routing hubs.